The advantages of using UV-LIGA technology

The replication of the geometry is achieved to a very high resolution, derived from the miniaturisation practices of microelectronics. This allows the production of very precise microstructures as well as very complex geometries. Take the example of a microspring: the height/width ratio of the blade can easily reach a form factor of ≤5.


The electroforming technology offers significant design freedom. The only limitation is our imagination. Technology enables us to create microcomponents that combine several functions in one. This simplifies certain steps in the assembly process. By multiplying photolithography operations, it is possible to produce parts that can be assembled on up to three levels. When viewed as 2.5D, the side faces will be perfectly vertical.


The UV-LIGA process makes it possible to cover a wide variety of microcomponents. Their dimensions can vary from 0.5 to 2000 mm2 and their thickness from 50 to 1000 µm. The miniaturisation and fineness of certain details of these components can go as low as 20 µm. For example, we produce microsprings with very thin blades, microfluidic channels, etc.


This additive manufacturing technique consists of filling the cavity made by photolithography in a galvanic bath. The engineering of materials has led to the development of a range of thick-film electroformable materials that include Ni, NiP, LigaFlex™, Amaflex, 24-carat hard gold. Among these stainless materials, some have the advantage of being 100% non-magnetic, and others have greater elastic properties.